Welcome to meet you in Chengdu, China
December 22nd-24th, 2018
We would like to invite you to contribute to and participate in ICCCAS 2018, which will be held in
Chengdu, China during December 22nd-24th, 2018. ICCCAS is an annual conference series since 2002 and initiated by University of Electronic Science and Technology of China.
2018 the X International Conference on Communications, Circuits and Systems (ICCCAS 2018) is a forum for presenting excellent results and new challenges facing the field of
Communications, Circuits and Systems. It brings together experts from industry, governments and academia, experienced in engineering, design and research.
The ICCCAS 2018 is co-sponsored by Sichuan Institute of Electronics and IEEE, co-organized by supported by Sichuan University, Southwest Jiaotong University
and University of Electronic Science and Technology of China, and it is endorsed by many Universities in Sichuan Province.
ICCCAS 2018 offers a rich program, including keynote talks, regular papers, together with free
academic visiting in Kean University. We need your contribution and participation to make it a successful event. You can be encouraged by the fact that the excellent presentation and best paper award will be granted. The conference proceedings will be indexed by
Ei Compendex and Scopus.
We hope that you will join us at ICCCAS 2018.
Submission Deadline: November 09th, 2018
Notification Deadline: November 23rd, 2018
Registration Deadline: November 30th, 2018
After a careful reviewing process, all accepted papers after proper registration and presentation, will be published in the
ICCCAS2018 conference Proceedings, and reviewed by the IEEE Conference Publication Program for
IEEE Xplore, Ei Compendex and Scopus.
How to Submit/投稿方式
Authors are invited to submit papers through the Electronic Submission System to ICCCAS2018.
a. Your submission will be reviewed by the conference scientific committee.
b. Only Full paper submission will be published in conference proceedings if accepted.
Call for Papers
Call for Papers is now open.
A full 3-day programme is currently being built.
A growing list of invited speakers will be announced over the upcoming months.
Sponsored by / 主办单位
Co-organized by / 联合协办