Topic: 3D IC and Advanced Packaging Technologies

 Submission Link: https://easychair.org/conferences/?conf=icccas2025

Special Session Chair

Bowen Jia 贾博文

Wuhan University of Technology, China 武汉理工大学

Biography: Dr. Bowen Jia is an associate professor in the School of Information Engineering at Wuhan University of Technology (WHUT). He received the Ph.D in Electrical and Electronic Engineering from Nanyang Technological University (NTU) in 2018, and the M.S. and B.S degree from Zhejiang University and Wuhan University of Technology, respectively. His research interest focuses on electronic design automation (EDA), AI and optoelectronics. He has published more than 40 papers as an author and co-author in ACM TODAES, Integration, Chinese Journal of Electronics, etc. He currently serves as the deputy secretary-general of the Hubei Institute of Electronics and has been selected into the Hubei Province Youth Talent Program.

 

Special Session 12 Speakers

 

Pingqiang Zhou ShanghaiTech University, China	Rumin Zhang Chiplet Design and Manufacturing of Zhejiang Province, China; Eastern Institute of Technology, Ningbo, China	Peng Liu Xpeedic Semiconductor EDA R&D Department, China	Xiaoming Liu Empyrean Technology Co., Ltd., China
Keren Zhu Fudan University, China